| 配方類型： |
METALS AND THEIR TREATMENT |
| 配方說明： |
Copper Plating Baths for Printed Circuits |
| 配方組成： |
Sodium cyanide/4.6 oz/gal
FORMULA No.4
Sulfate Copper
Current density/25 amp/ft^2
Cost/gal/$2.00
cost/gal/$0.55
pH/12.5 oz/gal
Pyrophosphate Copper:
Proprietary salts/45 oz/gal
Ammonia/0.7 fl. oz/gal
"Temperature"/130-140F
Agitation/Air
Sodium carbonate/4.0 oz/gal
Current density/40 amp/ft^2
Cost/gal/$1.70
Temperature/140F
Copper cyanide/3.5 oz/gal
copper sulfate/30 oz/gal
Sulfuric acid/8 oz/gal
Brightener/70-75F |
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