| 配方類型： |
METALS AND TREATMENTS |
| 配方說明： |
Copper Plating |
| 配方組成： |
Average Current Density, no agitation/75-125 amp/sq ft
Copper Metal (Cu)/60 g/l
Limiting* Current Density at 80F/150 amp/sq ft
Limiting* Current Density at 120F/250 amp/sq ft
Operating Conditions pH (colorimetric)/0.8 to 1.7
Average Tank Voltage/3-5
*Maximum Current Density without burning based on laboratory in
thickness using no agitation.
Boric Acid/15 g/l
Temperature/80-170F
Copper Fluoborate (Cu(BF4)2)/224 g/l
Cathode Current Density:
Baume at |
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